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Graphics Memory

256Mb | HY5PS561621AFP

  • Computing Memory
  • Consumer Memory
  • Graphics Memory
  • Mobile Memory
  • NAND Flash
DDR3 SDRAM :[Com.][Mod.] DDR2 SDRAM :[Com.][Mod.] DDR SDRAM :[Com.][Mod.]
DDR2 SDRAM | DDR SDRAM | SDR SDRAM : [Com.] [Mod.]

Technical Data Sheet

Part Number Rev. Updated Date Remark
HY5PS561621AFP 1.2 2006-09-08  Lead free

Features

    • VDD/VDDQ=2.0V +/- 0.1V(500/450MHz)
    • 1.8V VDD/VDDQ wide range max power supply supports(400/350/300MHz)
    • All inputs and outputs are compatible with SSTL_18 interface
    • Fully differential clock inputs (CK, /CK) operation
    • Double data rate interface:two data transfers per clock cycle(tCK)
    • Source synchronous-data transaction aligned to bidirectional data strobe (DQS, /DQS)
    • Differential Data Strobe (DQS, /DQS)
    • Data outputs on DQS, /DQS edges when read (edged DQ)
    • Data inputs on DQS centers when write(centered DQ)
    • On chip DLL align DQ, DQS and /DQS transition with CK transition
    • DM mask write data-in at the both rising and falling edges of the data strobe
    • All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
    • Programmable CAS latency 4, 5, 6 and 7 supported
    • Programmable additive latency 0, 1, 2, 3, 4, 5 supported
    • Programmable burst length 4/8 with both nibble sequential and interleave mode
    • Internal four bank operations with single pulsed RAS
    • Auto refresh and self refresh supported
    • tRAS lockout supported
    • 8K refresh cycles /64ms
    • JEDEC standard 84ball FBGA(x16)
    • Full strength driver option controlled by EMRS
    • On Die Termination supported
    • Off Chip Driver Impedance Adjustment supported
    • Partial Array Self Refresh supported
    • High Temperature Self Refresh rate supported

Ordering Information

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