Regulation Compliance
Sustainability Green ProductRegulation ComplianceChina RoHS
개요
Management Methods for Controlling Pollution by Electronic Information Products : Administrative
guide and Management Methods on the Control of Pollution Caused by Electronic Information Products
Enforcement period : March 1, 2007
Requirement : Electronic Information Products Pollution Control Logos , Marking for Toxic or
Hazardous Material or Elements, Recycle Mark of packing material
hazardous substances : 6 Hazardous Substance. Pb (Lead), Hg (Mercury), Cd (Cadmium),
Cr+6 (Hexavalent chromium), PBB , PBDE
| Substance | MCV(Maximum Concentration Value) |
|---|---|
| Cd | < 100 ppm |
| Pb | < 1000 ppm |
| Hg | < 1000 ppm |
| Cr+6 | < 1000 ppm |
| PBB | < 1000 ppm |
| PBDE | < 1000 ppm |
limit requirement of hazardous substances in SJ/T11363-2006
Electronic Information Products Pollution Control Logos
When hazardous substances are not used : hazardous substance safety mark is marked
When hazardous substances are used : "Environmental Protection Use Period" is marked
Marking for Toxic or Hazardous Material or Elements
If a certain hazardous substance is not contained in the component or hazardous substance contained in the component is below the limit requirement in SJ/T11363-2006 : 'O' is marked
If hazardous substance contained in the component is above the limit requirement in SJ/T11363-2006 : 'X' is marked
SK Hynix Component Product
Electronic Information Products Pollution Control Logos : 
Marking for Toxic or Hazardous Material or Elements
| Part Name | Toxic or hazardous Substances and Elements | |||||
|---|---|---|---|---|---|---|
| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| Si CHIP | O | O | O | O | O | O |
| GOLD WIRE | O | O | O | O | O | O |
| MOLD COMPOUND | O | O | O | O | O | O |
| LEAD FRAME | O | O | O | O | O | O |
| SUBSTRATE | O | O | O | O | O | O |
| SOLDER BALL | O | O | O | O | O | O |
- O : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- X : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
SK Hynix Module Product
Electronic Information Products Pollution Control Logos : 
Marking for Toxic or Hazardous Material or Elements
| Part Name | Toxic or hazardous Substances and Elements | |||||
|---|---|---|---|---|---|---|
| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| Component | O | O | O | O | O | O |
| PCB | O | O | O | O | O | O |
| ACTIVEIC | O | O | O | O | O | O |
| CAPACITOR | O | O | O | O | O | O |
| RESISTOR | X | O | O | O | O | O |
- O : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- X : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level
SK Hynix CIS Product
Electronic Information Products Pollution Control Logos : 
Marking for Toxic or Hazardous Material or Elements
| Component Name | Hazardous Substances or Elements | |||||
|---|---|---|---|---|---|---|
| Lead (Pb) |
Mercury (Hg) |
Cadmium (Cd) |
Hexavalent Chrome (Cr6+) | Polybrominated Biphenyl(PBB) | Polybrominated Biphenyl Ether(PBDE) | |
| Si CHIP | O | O | O | O | O | O |
| GLASS | O | O | O | O | O | O |
| SOLDER BALL | O | O | O | O | O | O |
- O : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requiremnet in SJ/T11363-2006
- X : Indicates that this toxic or hazardous substance containded in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
Recycle Mark of packing material
This mark is attached to inner and outer packing Box.
'CB' mean that the used packing material of products is Corrugated Cardboard.
Standard : GB18455-2001 of China (Packaging Recycling Marks standard)
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