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Hynix Newsletter
August
2010
1.
Hynix Notice Board!
2.
Release of Customer Samples of 44nm 512Mb DDR2
3.
Volume Production of 26nm 64Gb NAND Flash
One Point Relief
: From Brick to Smart Phone
July
2010
1.
Hynix develops 44nm based 2Gb DDR3, 1866Mbps
2.
Hynix will start volume production of 44nm 2Gb GDDR5
One Point Relief
: History of Computer Games
June
2010
1.
Development of DDR3 SDRAM operating at 1.25V
2.
Release of 32nm based high speed SLC NAND
3.
Hynix introduces 4Gb NAND + 4Gb Mobile DRAM PoP
One Point Relief
: Who changes the world?
May
2010
1.
Introduction of 44nm 1Gb DDR3 (x8/x16)
2.
Hynix introduces new VGA ShellUT type CSP Image Sensor
April
2010
1.
Hynix develops DDR3 16GB LRDIMM (Load Reduced DIMM)
2.
Hynix plans to release 2GB uSD based on triple bit cell
March
2010
1.
Hynix receives DDR3 RDIMMs and ECC UDIMMs validation on Westmere
2.
Starting mass production of 44nm 2Gb DDR3 (x16) for graphics
3.
Release E2NAND2.0 for NAND Flash applications
February
2010
1.
44nm 2Gb DDR3 based modules validated by Intel
2.
Release 32nm NAND based eMMC 4.4 product
3.
Introduce 54nm 256Mb & 512Mb DDR SDRAMs
January
2010
1.
Development World's first 2Gb LPDDR2 Mobile SDRAM
2.
Release Customer sample of 32nm 32Gb MLC NAND Flash
3.
Announcement on the industry's fastest 7Gbps 2Gb GDDR5
December
2009
1.
Introduce 4Gb DRAM only PoP
2.
Announcement of 16GB DDR3 RDIMM validated by Intel
November
2009
1.
Introduce Solid State Drives & Modules
2.
Announcement of 44nm 2Gb DDR3 products validated by Intel
October
2009
1.
Release of 41nm eMMC4.3
2.
Introduce VGA ShellUT Type CSP Image Sensor Sample
September
2009
1.
Unveiling Industry's first 1Gb DDR3 Low Power
2.
New Memory Solution for Wireless Data Cards
August
2009
1.
41nm NAND based uSD product presents new market opportunities
2.
Introducing 3.2Gbps, 1Gb GDDR5 Graphics DRAM with low power supply voltage
July
2009
1.
54nm 2Gb DDR3 based modules validated by Intel
2.
Hynix Future Memory Technology
3.
New Micro SD card based on 41nm NAND
4.
Hynix CIS penetrates notebook market
June
2009
1.
eMMC Flash Storage using 41nm Technology
2.
Hynix Introduces new 3megapixel Image Sensor
May
2009
1.
The World¡¯s Number Two Mobile Memory Manufacturer in 2009
2.
Hynix completes internal qualification for 54nm 1Gb GDDR5 graphics memory
3.
Hynix Image Sensor successfully enters the Taiwan NetBook market
April
2009
1.
54nm DDR3 Server DIMM Passes Intel Validation
2.
MCP (4Gb NAND+2Gb DRAM) using Innovative Package-on-Package (PoP) Technology
3.
NAND Flash 32Gb pSLC (Pseudo SLC) Product using 41nm Technology
4.
NAND Flash 48nm 32Gb TLC Based Emulated NAND Product
5.
New VGA Image Sensor with Optimized Low Light Performance
March
2009
1.
8GB DDR3 MetaRAM receives Intel Validation
2.
NAND Flash 41nm 32Gb MLC Customer Sample Release
February
2009
1.
Development of World¡¯s First 44nm-Class 1Gb DDR3 DRAM
2.
Introduction of Industry¡¯s Fastest 1.3GHz 1Gb GDDR3
3.
Extension of Partnership with MediaTek
4.
Release of Brand New Features of 2M CMOS Image Sensor
January
2009
1.
New Year Message from Executive Vice President
2.
Making revolution in mobile application by developing the world¡¯s first 2Gb Mobile DRAM
3.
Bolstering product lineup with ¡®No Focus Adjustment Module'
4.
1.4um-pixel image sensors launching schedule to be brought forward
December
2008
1.
Hynix receives DDR3 Server DIMM validation on Nehalem Platform
2.
Hynix unveils Top-Tier Package-on-Package (PoP) Memory Components
3.
PATA & SATA SSD Module using 4xnm MLC Technology
November
2008
1.
Hynix proudly first to receive validation for 66nm 2Gb DDR3 based 4GB SODIMM
2.
1Gb Low Power DDR stands out in its features
3.
Hynix unveils 1Gb DDR3 with leading technology
4.
Hynix launches new industry leading CIS products
5.
NAND Flash 48nm 8Gb MLC targets for Micro SD market
October
2008
1.
Proving superiority in high density product development
2.
High Density & High Performance in one package, Ci-MCP (Card-Interface MCP)
3.
Unique features of 512Mb DDR3 exceed customer expectations
4.
41nm process based 32Gb MLC opens up a new era
September
2008
1.
Hynix announces Validation Pass of 66nm DDR3 UDIMM
2.
Why Hynix 1Gb GDDR3 ?
3.
Hynix eMMC is paving the way in the embedded market
4.
Hynix launched high resolution Ultra Small VGA CMOS Image Sensor
5.
World¡¯s first x3 32Gb NAND Flash by Hynix
August
2008
1.
Hynix Recent Events
2.
Low Cost solution for High Density Server Memory
3.
1Gb GDDR5
4.
1Gb Low Power DDR2
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