February 2010
The Second Edition
 32nm eMMC 4.4 Product Announcement  
 Key features
Hynix has completed developing 4GB~32GB eMMC 4.4 using 32nm NAND components based eMMC 4.4 and is planning supply engineering samples (ES) starting from February 2010.

eMMC consists of a Flash Controller and NAND Flash in a single package, which reduces the need to redesign or make firmware changes in the Host Controller. This reduces the time required by manufacturers to introduce new end-use applications. Hynix eMMC solutions are compliant to JEDEC standards and features such functions as ECC (Error Correction and Check), Wear-leveling and Data Protection on Power Loss.

eMMC 4.4 product released this year was developed for mobile applications and offers improved security features and NAND partition control which offer designers the ability to save Data securely and conveniently.

The NAND partitioning feature allows developers to form separate MLC and SLC NAND partitions. The SLC may be used to store frequently accessed boot code, while MLC used for data storage. This reduces component costs and saves board space in mobile applications since a separate SLC NAND component is not required.

Our newly developed 32nm eMMC 4.4 performs faster read/write operations with its larger page size and optimized eMMC controller.

The Hynix eMMC product family meets the demand for future mobile applications requiring high performance, and secure high density storage.
 Product Lineup
Part Number Density Tech. Interface Spec. Package Size
(mm)
Engineering
Sample
H26M31001EFR 4GB 32nm MMC4.4 12 x 16 x 1.2 Now
H26M42001EFR 8GB 12 x 16 x 1.2 Now
H26M54001BKR 16GB 14 x 18 x 1.2 Now
H26M68001ANR 32GB 14 x 18 x 1.4 End of March
 
 
  For more information on the product, please contact us. hynix_newsletter@hynix.com